Samsung HBM5 will introduce 2nm process.
2026-03-18 10:18:13
According to South Korean media BusinessKorea,Samsung Electronics recently confirmed that it has started the research and development of the eighth generation of high-bandwidth memory HBM5,and plans to adopt 2nm process technology on the Base Die for the first time,breaking the industry tradition.
At a recent technical communication meeting held in California,the relevant person in charge of Samsung's electronic memory business disclosed the company's latest roadmap in the field of AI storage:
HBM5(eighth generation):Its bottom chip will be manufactured by Samsung OEM department by 2nm process.Compared with the 4nm node commonly used in HBM4,the 2nm process can significantly improve the energy efficiency ratio and thermal management ability,so as to better cope with the heat dissipation challenge brought by the improvement of AI computing power.Core Die continues to use 1c(the sixth generation 10nm level)technology.
HBM5E(9th generation):Samsung plans to adopt a more active strategy,and the core chip will be introduced into 1d(7th generation 10nm level)DRAM process in advance.This means that Samsung will complete the leap from 1c to 1d in a short time to pursue higher data transmission density and storage performance.
Shenzhen Ramsun Microelectronics Co.,Ltd（Ramsun International） is a vendor of the seimicondutor componets and the memory IC’s solution with clear market advantage. We still focus on the promotion for some famous semicondutor brand ,and specially take the RAM(Random Access Memory) as our core products.
We are the authorized agent as designated by NETSOL、JSC、EVERSPIN、NETSOL、VTI、IPSiLog and Sinochip.And Lyontek.so on.
